Dynamics Modeling and Identification of a Dual-Blade Wafer Handling Robot

摘要

This paper presents the dynamics modeling and dynamic identification of a dual-blade wafer handling robot. An explicit form dynamic model for this 8-link parallel robot is proposed. The dynamic model is transformed into a decoupled form to enable dynamic parameters identification with least-square regression. A well conditioned trajectory is chosen for identification experiment. Both viscous friction and Coulomb friction are considered to make the model more reliable. Model has been validated by experiments.