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Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment

Jens L. M. Taprogge, Felix Beyeler, A. Steinecker, Bradley J. Nelson

发表年份
2012
引用次数
3

关键词

Microelectromechanical systemsChipSolderingProcess (computing)RoboticsMaterials scienceElectronic packagingSubstrate (aquarium)ThroughputElectronic engineering

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