Non-robotic fabrication of packaged microsystems by shape-and-solder directed self-assembly

摘要

The non robotic fabrication of packaged microsystems that contain non-identical parts has been accomplished by a directed self-assembly process. The self-assembly process uses geometrical shape recognition to identify different components and subsequent bond formation between liquid solder and metal coated areas to form mechanical and electrical connections. We applied this concept of shape recognition and subsequent formation of contacts to assemble and package microsystems that contained three building blocks: a silicon carrier, a semiconductor device segment, and a glass encapsulation unit. As semiconductor device segments, we tested 200 micrometer sized light emitting diodes. The microsystems self-assembled by sequentially adding parts to the assembly solution. Six hundred AlGaInP/GaAs light emitting diode segments self-assembled onto device carriers in 2 minutes without defects. Encapsulation units self-assembled onto the LED carrier assemblies to form a three-dimensional circuit path to operate the final device.