Uma J. Kokilepersaud
Papers
1
Total Citations
11
H-Index
1
About
Uma J. Kokilepersaud is pioneering the intersection of soft materials and electroadhesion, with a focus on creating programmable, three-dimensional structures from gels and capsules. Her most-cited work, "Universal Way to 'Glue' Capsules and Gels into 3D Structures by Electroadhesion" (2023, 11 citations), introduces a groundbreaking method that uses electric fields to bond diverse soft materials—such as covalently cross-linked hydrogels—into complex architectures. This approach bypasses traditional chemical glues, offering a reversible, energy-efficient, and universal strategy for assembling soft matter. By demonstrating that electroadhesion works across cationic and anionic materials of varying origins, Kokilepersaud has opened new avenues for tissue engineering, soft robotics, and drug delivery systems. Her work stands out for its simplicity and scalability, enabling the rapid fabrication of multi-material 3D constructs without specialized equipment. As a rising voice in materials science, Kokilepersaud’s contributions are already shaping how researchers think about modular assembly in soft systems, with potential to transform fields from biomedical devices to adaptive structures.
Research Focus
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Top Papers
- 1