L. Di Cioccio

Papers

Total Citations

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About

L. Di Cioccio is a leading figure in microelectronics, whose work has been pivotal in advancing three-dimensional (3D) integration—a critical pathway for extending Moore’s Law. Her research centers on wafer bonding, self-assembly, and heterogeneous integration, with a particular focus on die-to-wafer assembly techniques. Di Cioccio’s most cited work, "Self-alignment of silicon chips on wafers: A capillary approach" (2010, 54 citations), introduced a groundbreaking method for chip alignment using capillary forces, overcoming the speed and precision limitations of robotic assembly. This innovation directly addresses the challenges of 3D integration, enabling faster, more reliable stacking of microelectronic components. Her contributions have been instrumental in pushing the boundaries of semiconductor packaging and system miniaturization, with her papers serving as foundational references for researchers tackling the physical constraints of Moore’s Law. Di Cioccio’s work is widely recognized for its practical impact on advanced manufacturing, making her a key figure in the evolution of next-generation microelectronic systems.