Dacheng Wei
Papers
2
Total Citations
303
H-Index
2
About
Dacheng Wei is a leading researcher in the synthesis and application of two-dimensional (2D) materials, with a particular focus on advancing flexible electronics and high-performance devices. His work centers on developing innovative fabrication techniques, such as plasma-enhanced chemical vapor deposition (PECVD), to create high-quality 2D materials and interfaces. A major contribution is his demonstration that using hexagonal boron nitride (h-BN) as a dielectric interfacial layer significantly enhances both carrier mobilities and saturated power densities in devices, achieved through a clean, closely contacted interface and improved thermal dissipation. This breakthrough has enabled promising applications in next-generation electronics. Wei’s impact is reflected in his highly cited works, including a 2021 paper on PECVD for 2D materials (179 citations) and a 2020 study on microconformal electrode-dielectric integration for flexible, ultrasensitive robotic tactile sensing (124 citations). His research not only advances fundamental materials science but also paves the way for practical, high-performance flexible sensors and electronic systems, making him a key figure in the field.
Research Focus
Key Achievements
Top Papers
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