Cheng Bai

Xiamen University

Papers

1

Total Citations

78

H-Index

1

About

Cheng Bai is a researcher advancing the field of flexible sensor technology, with a primary focus on piezoresistive sensing and three-dimensional force detection. His most notable contribution is the development of a flexible piezoresistive three-dimensional force sensor based on interlocked structures, a design that mimics biological tactile systems to achieve high sensitivity and directional force discrimination. This work, published in 2021 and garnering 78 citations, has been instrumental in pushing the boundaries of wearable electronics and robotic tactile interfaces. By engineering interlocked microstructures, Bai’s sensor enables precise measurement of normal and shear forces, addressing a critical challenge in soft robotics and human-machine interaction. His research not only demonstrates innovative material integration but also offers practical pathways for next-generation haptic devices. With a growing citation impact, Cheng Bai’s work continues to inspire developments in flexible electronics, positioning him as a key contributor to the evolution of intelligent, skin-like sensing systems.

Research Focus

Key Achievements

1
H-Index
1
Papers
78
Total Citations
78
Avg Citations/Paper
🏆 Most Cited Paper
Flexible piezoresistive three-dimensional force sensor based on interlocked structures
78 citations · 2021
📈 Most Prolific Year: 2021 (1 Papers)
🤝 Key Collaborators: 6
🏛 Institutions: Xiamen University

Top Papers

  1. 1

Key Collaborators

Contact & Links

Available for collaboration
Content generated · 12 days ago