Shau-Fei Cheng

Industrial Technology Research Institute

Papers

Total Citations

H-Index

About

Shau-Fei Cheng is a leading researcher in advanced packaging and flexible hybrid electronics (FHE), with a focus on enabling next-generation, bendable, and stretchable electronic systems. Her most cited work, "Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems" (2019, 7 citations), pioneers the integration of panel-level packaging with FHE, addressing critical challenges in manufacturing scalable, high-performance flexible devices. This contribution bridges traditional semiconductor packaging with emerging flexible substrates, offering a pathway to create innovative products that meet the demands of wearables, IoT, and biomedical applications. Cheng’s research is pivotal in advancing the reliability and cost-effectiveness of flexible electronics, laying groundwork for commercial adoption. Her work has been recognized for its potential to transform the electronics industry, and she continues to drive innovation in packaging technologies that enable thinner, lighter, and more adaptable systems. With a growing citation impact, Cheng’s contributions are essential reading for students and researchers exploring the intersection of packaging, materials, and flexible electronics.