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μ<sup>3</sup>: Multiscale, Deterministic Micro-Nano Assembly System for Construction of On-Wafer Microrobots

Avishek Das, Ping Zhang, W.H. Lee, Dan O. Popa, H.E. Stephanou

Year
2007
Citations
74

Abstract

One of the major issues enduring with micro-scale mechanics has been to design high fidelity miniature machines capable of performing complex operations. Though achieved in some proportion through conventional in-plane and out-of-plane designs, the efficacy of such micro-electromechanical systems (MEMS) structures is highly limited due to complicate fabrication and inadequate robustness. On the other hand, the use of precise robots to assemble MEMS parts of comparatively simpler design to build 3D micromechanical structures has recently emerged as a viable approach. Such modular assemblies of microscale parts typically utilize minimum energy connectors that are multifunctional, e.g., mechanical, electrical etc. The μ <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sup> is a 3D microassembly station consisting of 19 DOF arranged into 3 micromanipulators, with additional microgrippers and stereo microscope vision. The platform is capable of motion resolutions of 3nm and is small enough to be used inside of a scanning electron microscope (SEM) for nano-manipulation. In this paper we discuss how systematic identification and calibration of the station, combined with appropriate part connector designs can lead to multi-degree of freedom active MEMS robots assembled on a wafer

Keywords

Microelectromechanical systemsMicroscale chemistryWaferModular designRobustness (evolution)RobotTestbedMechanical engineeringComputer scienceNanotechnology

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