Self‐Assembly: A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine (Adv. Mater. 34/2014)

摘要

On page 5942, H. O. Jacobs and co-workers develop an automated reel-to-reel assembly machine to assemble semiconductor dies on flexible substrates. The process is inspired by nature and uses a concept of directed self-assembly instead of conventional robotic pick-and-place. The machine is tailored to the fabrication of solid-state lighting panels that require the distribution and electrical connection of LEDs over large areas at low cost. At present, the process is able to assemble 15 000 chips per hour.