Vision System for Automatic Inspection of Solder Joints in Electronic Boards

摘要

In this work, a vision system oriented to the quality inspection of solder joints in electronic boards is presented. The proposed vision system is composed of two cameras (one frontal and one lateral), to achieve a general view of the joints; a light source, to ensure good and robust lighting conditions; and a mobile system (i.e. 3-axis cartesian robot), to automatically move to each image capture position and get the optimal focus. Moreover, a classifier based on Artificial Intelligence is fed with the captured images to perform an automatic inspection of the soldering joints. The output for each one of them is the belonging to either a correct or incorrect joint group. The tests carried out with real samples show the validity of the proposed system for its future deployment in the factory.