The Electrical Characteristics Investigation of the Module-Level Miniaturization with Embedded Device Technology

摘要

Previously, we developed a high-density assembly technology to miniaturize the motion control CPU SiP for humanoid robots. It is necessary to mount a number of passive components on an expensive buildup PWB to accomplish this CPU SiP assembly and satisfy electrical performance requirements. As a result, we developed an embedded device technology to realize further miniaturization and achieve excellent electrical performance with the CPU SiP. This paper is intended as an investigation of the impacts of module-level miniaturization with embedded active device technology on the electrical performance. From our investigation, it is concluded that the CPU-embedded SiP has excellent electrical performance, such as signal reflection, cross-talk noise and simultaneous switching output noise. In addition, the CPU-embedded SiP has sufficient signal transmission properties for a data rate of 4 Gbps. The results of this investigation will change the future technology position of module-level miniaturization with embedded device technology.