A compact Robot-based defect detection device design for silicon wafer

摘要

Abstract With the development of semiconductor chips manufacturing, the quality of chips are required to a higher level. At present, as a key element of chip produce process, wafer surface defect detection is a hard challenge for operators, as manual detection accuracy and efficiency are depend on such factors as visual fatigue and inspection error. This paper proposes a defect detection approach for silicon wafer and designs a control system. The system takes PLC as the control core in charge the communication of the PC and the robots, which carries out the logical control instruction. The silicon wafer images are taken by a high precision camera, and processed by the algorithms and the defect elements central coordinates are output to robots. The four-axis robots are driven by the servo motors to mark the defective elements. In order to improve work efficiency, two robots were designed to cooperate to realize wafer transplanting and marking. The device runs smoothly and efficiently, and has prospecting application future.