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Surface Electrostatic Damage by Microprocess Robotic Machines: Diagnosis and Reliability, Process Auditing, and Remedies

P. Jacob, G. Nicoletti

发表年份
2006
引用次数
6

摘要

Electrostatic discharge (ESD) is generally known as a discharge phenomena via device pins. Many precautions have been taken against ESD, mostly considering workplace protection, pad protection structures. However, electrostatic events, originating from robotic semiconductor wafer- and device-processing seems at least a problem of similar severeness, which has not been considered enough, yet. This paper describes electrostatic mechanisms in most common assembly process tools, how to do diagnostics on devices and tool auditing. Auditing experiences are listed and hints how to improve tool-related ESD are described

关键词

Electrostatic dischargeReliability (semiconductor)AuditProcess (computing)Reliability engineeringSemiconductor industryWaferComputer scienceEngineeringMechanical engineering

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