Bond graph modeling and simulation of mechatronic systems

摘要

The traditional modeling and simulation techniques for dynamic systems are generally adequate for single-domain systems only. Mechatronic systems, being a mix of mechanical and electronic systems, deal with multi-domain systems. Such systems may typically include translational, rotational, thermofluid, electrical, electromechanical and electronic systems. Modeling and simulation of such multi-domain systems pose formidable new challenges and, hence, demand new strategies and techniques for reliable solutions. The bond graph method (BGM) is rapidly emerging to offer a new modeling and simulation methodology that is ideally suited to effectively unify knowledge pertaining to multi-domain systems for mechatronic applications. The BGM combined with genetic programming (GP) offers tremendous opportunities in artificial intelligence, image processing, and robotic and industrial automation, The extension of BGM for applications to fields such as social behavior, economics and operational research is a very active topic of current research. This work illustrates the methodology offered by BGM for modeling and simulation of mechatronic systems.