Hybrid pressure-tolerant electronics

摘要

When working in deep-sea environments, the ambient pressure of the water column causes special design effort on the integration of electronic components for robotic structures. Until recently, electronic modules required housings which allowed the use of electronics at pressure conditions like they are on land. These housings increased the costs and the dimensions of the overall system as those modules are bulky and expensive to manufacture. Other ways have to be taken when designing miniaturized components. A hybrid approach between pressure tolerant systems design and pressure hulls enables the realization of miniaturized and cost-effective components for deep-sea.