Papers
2
Total Citations
48
H-Index
2
About
Pengchong Wei is a materials scientist whose research centers on the atomic-scale mechanics of polymer–inorganic interfaces, with a particular focus on polysiloxane elastomers and their adhesion to silica. His most cited work, a 2021 study in *Langmuir* on molecular dynamics simulations of PDMS–silica adhesion energy, has garnered 46 citations and systematically reveals how molecular chain structures and thermal conditions govern interfacial bonding—a foundational insight for designing durable, flexible electronics and biomedical coatings. Wei’s more recent 2024 investigation into side-group modifications further advances this understanding, demonstrating how subtle chemical tailoring can tune both glass transition temperatures and adhesive performance at the atomic level. By bridging computational modeling with practical material design, his contributions offer a predictive framework for optimizing silicone-based adhesives in applications ranging from microfluidics to soft robotics. Wei’s work is distinguished by its rigorous atomistic detail and its direct relevance to industrial challenges in adhesion reliability.
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