Mike Renn

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About

Mike Renn is a leading innovator in the field of flexible and printed electronics, with a particular focus on advanced manufacturing techniques for high-performance sensing devices. His most impactful work centers on the development of deformable temperature sensors, addressing critical needs in soft robotics, biometric sensing, cryopreservation, and flexible electronics. Renn’s landmark 2019 paper, "High Performance Flexible Temperature Sensors via Nanoparticle Printing," has garnered 74 citations and introduces a groundbreaking method using rapid aerosol jet printing of Cu–CuNi thermocouples onto flexible Kapton substrates. This work overcomes key limitations in traditional fabrication, enabling scalable, high-resolution, and mechanically robust sensors without sacrificing performance. By demonstrating that printed nanoparticle-based sensors can match or exceed the sensitivity of conventional rigid devices, Renn has paved the way for integrating reliable thermal sensing into next-generation wearable and robotic systems. His contributions are instrumental in bridging the gap between laboratory-scale prototyping and real-world deployment of flexible electronics, making him a pivotal figure in the evolution of printed sensor technology.