Wilson Hong

Siliconware Precision Industries (Taiwan)

Papers

1

Total Citations

6

H-Index

1

About

No biography available yet.

Research Focus

Ball grid array1 · 6 citations
Chip1 · 6 citations
Chip-scale package1 · 6 citations
Composite material1 · 6 citations
Computer science1 · 6 citations
Dissipation1 · 6 citations
Electronic engineering1 · 6 citations
Electronic packaging1 · 6 citations
Engineering1 · 6 citations
Flip chip1 · 6 citations
Integrated circuit1 · 6 citations
Adhesive1 · 6 citations

Key Achievements

1
H-Index
1
Papers
6
Total Citations
6
Avg Citations/Paper
🏆 Most Cited Paper
Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
6 citations · 2021
📈 Most Prolific Year: 2021 (1 Papers)
🤝 Key Collaborators: 5
🏛 Institutions: Siliconware Precision Industries (Taiwan)

Top Papers

  1. 1
    Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials
    6 citations · 2021

Key Collaborators

CFC. F. Lin1 shared papersKHKuo Haw Yu1 shared papersYLYu Lung Huang1 shared papersCKC. Key Chung1 shared papersRJRung Jeng Lin1 shared papers
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