Robotic dual-tip assembly for nanowire handling and integration

Abstract

This paper presents the usage of a nanorobotic handling technique for the transfer of individual ZnO-nanowires with diameters of about 100nm and length of up to 10 μm. Handling and assembly are inside the SEM and use a dual-tip approach facilitating an easy controllable three-dimensional positioning of the nanowire. The actual handling sequence works without adhesive bond technique, therefore it operates with low-contaminations and is time saving in comparison to conventional approaches. The handled nanowires are integrated into electrode structures, establishing an field-effect transistor device, which is characterized in-situ.