Conductive Adhesives: Alternative to High Temperature Solders and The Future

Abstract

Isotropic conductive adhesives have excellent attributes as heat-resistant lead-free high temperature interconnection materials as well as those enabling low temperature manufacturing of circuits. Ag metallic particles from nano-scale to micron-scale are combined with organic matrix to provide sound high-temperature lead-free interconnection. Micron-sized Ag particles paste can provide flexible wiring in combination with silicone-based resin. The ultra flexible skin sensor for a robot was successfully fabricated from the newly developed Ag-silicone conductive adhesive. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers on a SiP structure with Ag nanopastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.