Fan-out
相关论文数: 1
顶级研究者
最高引用论文
Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems
Wei‐Yuan Cheng, Shau-Fei Cheng, Chen-Tsai Yang, Wei-Han Chen, Hsin‐Cheng Lai, Tai-Jui Wang, Yuh-Zheng Lee
引用数: 7 • 2019
相关论文数: 1
Application of Fan-Out Panel Level Packaging Techniques for Flexible Hybrid Electronics Systems
Wei‐Yuan Cheng, Shau-Fei Cheng, Chen-Tsai Yang, Wei-Han Chen, Hsin‐Cheng Lai, Tai-Jui Wang, Yuh-Zheng Lee
引用数: 7 • 2019