Electronic packaging

Self-assembly for microscale and nanoscale packaging: steps toward self-packaging

Christopher J. Morris, S.A. Stauth, Babak A. Parviz

引用数: 113 • 2005

Conductive Adhesives: Alternative to High Temperature Solders and The Future

Katsuaki Suganuma

引用数: 6 • 2007

Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials

Yu Lung Huang, C. Key Chung, C. F. Lin, Kuo Haw Yu, Rung Jeng Lin, Wilson Hong

引用数: 6 • 2021

Application specific interconnection system for cutting edge packaging technology

Russell J. Abbott

引用数: 4 • 2001

Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments

Jens L. M. Taprogge, Felix Beyeler, A. Steinecker, Bradley J. Nelson

引用数: 4 • 2013

Parallel Packaging of Micro Electro Mechanical Systems (MEMS) Using Self-alignment

Jens L. M. Taprogge, Felix Beyeler, A. Steinecker, Bradley J. Nelson

引用数: 3 • 2012

Robotic Micromanipulation for Active Pin Alignment in Electronic Soldering Industry

Hao Ren, Xinyu Wu, Wanfeng Shang

引用数: 2 • 2021

Vision System for Automatic Inspection of Solder Joints in Electronic Boards

Iñigo Mendizabal-Arrieta, Hugo Álvarez, Garazi Alfaro, Daniel Aguinaga, Iban Galarraga, Íñigo Barandiarán

引用数: 2 • 2024

Fine pitch and high density Sn bump fabrication

Jinglin Bi, Jin Jiang, Anmin Hu, Ming Li, Dali Mao, Tadatomo Suga

引用数: 2 • 2009

Reliability of SAC 305 Solder Interconnects on Double-Sided Flexible Printed Circuit Board Using X-Ray Micro-CT

Pradeep Lall, Kartik Goyal

引用数: 2 • 2017

Automated Assembly and Hermetic Packaging of MOEMS for Applications Requiring Extended Shelf-Lives

Dan O. Popa, Michael Deeds, Abiodun A. Fasoro, Heather Beardsley, Jeongsik Sin, Woo Ho Lee, Raúl Fernández

引用数: 2 • 2005