Manufacturing-robotic-induced "mechanical" damages on semiconductor dies: mechanics, electrostatics or what else ?

摘要

The paper has described most common surface failure mechanisms, pointing out a frequent - unknown failure type called ESDFOS. The most significant diagnosis hints have been shown to distinguish it from other surface-related failures, like mechanically-, laser-, FIB- or preparation artifact-driven surface-failure-mechanisms. The root cause for ESDFOS are mainly post wafer-assembly processes. That's why test results degrade from wafer final test to post-assembly test results. A "standardized" procedure has been recommended considering assembly process tool audits on ESD. Finally, the ouput of this paper should make the F/A community more sensitive to this "new", old failure type.