3D Printed Interconnects on Bendable Substrates for 3D Circuits

摘要

3D printing systems are expanding to realising fully embedded, multi-purpose, out-of-plane circuits. It is possible to utilise the characteristics of 3D printing to produce customisable, complex and bendable 3D structures and sensors that go beyond the use of standard polymer materials used with the current technology. With multi-material 3D printing, the additive manufacturing could be advanced to produce fully embedded sensors and electronic systems that cannot be otherwise produced in a one-step automated process. Our goals are concentrated towards embedding sensing circuits into next generation prosthetics and robotic arms for more advanced and smoother operation. These devices, along with other similar interests such as healthcare wearable devices, will inevitably include moving parts. Therefore, the embedded printed connections and readout circuits should withstand the repeatable bending of the robotic phalanges or sensing devices without degrading in performance or showing any cracks.