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Formation mechanism and modelling of exit edge-chipping during ultrasonic vibration grinding of deep-small holes of microcrystalline-mica ceramics

Guojun Dong, Chenyang Lang, Chen Li, Liming Zhang

发表年份
2020
引用次数
37

关键词

Materials scienceGrindingEnhanced Data Rates for GSM EvolutionIndentationMachiningComposite materialCeramicVibrationUltrasonic sensorAcoustics

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