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Highly conductive metal interconnects on three-dimensional objects fabricated with omnidirectional ink jet printing technology

Yasunori Yoshida, H. Wada, Konami Izumi, Shizuo Tokito

Year
2017
Citations
18
Access
Open access

Abstract

In this work, we demonstrate that highly conductive metal interconnects can be fabricated on the surface of three-dimensional objects using "omnidirectional ink jet" (OIJ) printing technology. OIJ printing technology makes it possible to perform ink jet printing in all directions by combining the motion of a 6-axis vertically articulated robot with precise positioning and a thermal drying process, which allows for the printing of stacked layers. By using OIJ technology, we were the first to successfully fabricate printed interconnect layers having a very low electrical resistance of 12 mΩ over a 10 mm length. Moreover, the results of the high-current test demonstrated that the printed interconnects can withstand high-current-flow of 5 A for 30 min or more.

Keywords

Materials scienceInkwellInterconnectionElectrical conductor3D printingFabricationSheet resistanceOmnidirectional antennaPrinted electronicsJet (fluid)

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