Post-processing time-aware optimal scheduling of single robotic cluster tools

Abstract

Integrated circuit chips are produced on silicon wafers. Robotic cluster tools are widely used since they provide a reconfigurable and efficient environment for most wafer fabrication processes. Recent advances in new semiconductor materials bring about new functionality for integrated circuits. After a wafer is processed in a processing chamber, the wafer should be removed from there as fast as possible to guarantee its high-quality integrated circuits. Meanwhile, maximization of the throughput of robotic cluster tools is desired. This work aims to perform post-processing time-aware scheduling for such tools subject to wafer residency time constraints. To do so, closed-form expression algorithms are derived to compute robot waiting time accurately upon the analysis of particular events of robot waiting for single-arm cluster tools. Examples are given to show the application and effectiveness of the proposed algorithms.