OTHER
Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Jennie S. Hwang
- 发表年份
- 2012
- 引用次数
- 20
关键词
SolderingSurface-mount technologySolder pasteElectronicsPrinted circuit boardReliability (semiconductor)RosinCircuit reliabilityElectronic componentMaterials science
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