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Spatially selective adhesion enabled transfer printing of liquid metal for 3D electronic circuits

Rui Guo, Yang Zhen, Xian Huang, Jing Liu

发表年份
2021
引用次数
50

关键词

ElectronicsElectronic circuitMaterials scienceLiquid metal3D printingTransfer printingStiffnessElectronic componentNanotechnologyMechanical engineering

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