Avi Yaverboim
Papers
1
Total Citations
26
H-Index
1
About
Avi Yaverboim is a leading researcher in advanced materials and additive manufacturing, with a primary focus on the development of novel conductive inks and processes for 3D printed electronics. His most notable contribution is the creation of a binuclear copper complex ink that serves as a highly effective seed layer for electroless copper plating. This breakthrough, detailed in his 2018 paper which has garnered 26 citations, enables the deposition of copper with over 70% bulk conductivity directly onto 3D printed polymers. This work is pivotal for the emerging field of 3D printed electronics, offering a scalable path to fabricate devices with embedded or conformal circuits for applications in the Internet of Things and soft robotics. By solving key challenges in adhesion and conductivity on complex polymer surfaces, Yaverboim’s research bridges the gap between additive manufacturing and high-performance electronic integration, establishing him as a key innovator in functional materials for next-generation manufacturing.
Research Focus
Key Achievements
Top Papers
- 1