Pose estimation using tactile sensor data for assembly operations
Morris R. Driels
- 发表年份
- 1986
- 引用次数
- 10
摘要
The paper describes the use of a gray scale tactile array sensor available in two specific geometric configurations. A larger pad, which has a 16 by 16 element array of sensors, is used to demonstrate the "image," processing capabilities of the system including a pose estimation algorithm for regular objects placed in contact with the pad. Following this, a smaller sensor with an 8 by 16 element configuration is developed for mounting directly in the fingertip of a robot gripper. The transfer of the software and hardware into a turnkey system suitable for factory-floor manufacturing assembly operations is described, along with an appropriate computer architecture for realizing the real time capabilities of the sensor.
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