Bernard T. Lee

University of Nebraska–Lincoln

Papers

1

Total Citations

101

H-Index

1

About

No biography available yet.

Research Focus

Adhesion1 · 101 citations
Adhesive1 · 101 citations
Composite material1 · 101 citations
Computer science1 · 101 citations
Fabrication1 · 101 citations
Layer (electronics)1 · 101 citations
Materials science1 · 101 citations
Metamaterial1 · 101 citations
Nanotechnology1 · 101 citations
Optoelectronics1 · 101 citations

Key Achievements

1
H-Index
1
Papers
101
Total Citations
101
Avg Citations/Paper
🏆 Most Cited Paper
Metamaterial adhesives for programmable adhesion through reverse crack propagation
101 citations · 2023
📈 Most Prolific Year: 2023 (1 Papers)
🤝 Key Collaborators: 8
🏛 Institutions: University of Nebraska–Lincoln

Top Papers

  1. 1
    Metamaterial adhesives for programmable adhesion through reverse crack propagation
    101 citations · 2023

Key Collaborators

MDMichael D. Bartlett1 shared papersDHDohgyu Hwang1 shared papersRLRong Long1 shared papersEJEric J. Markvicka1 shared papersCLChanhong Lee1 shared papersJFJason Finnegan1 shared papersJMJose M Pérez-González1 shared papersXYXingwei Yang1 shared papers
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