K.-W. Lee

Papers

1

Total Citations

26

H-Index

1

About

No biography available yet.

Research Focus

Chip1 · 26 citations
Direct bonding1 · 26 citations
Electrical engineering1 · 26 citations
Engineering1 · 26 citations
Integrated circuit1 · 26 citations
Materials science1 · 26 citations
Nanotechnology1 · 26 citations
Optoelectronics1 · 26 citations
Surface tension1 · 26 citations
Three-dimensional integrated circuit1 · 26 citations
Wafer1 · 26 citations
Wafer bonding1 · 26 citations

Key Achievements

1
H-Index
1
Papers
26
Total Citations
26
Avg Citations/Paper
🏆 Most Cited Paper
New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding
26 citations · 2012
📈 Most Prolific Year: 2012 (1 Papers)
🤝 Key Collaborators: 7

Top Papers

  1. 1
    New chip-to-wafer 3D integration technology using hybrid self-assembly and electrostatic temporary bonding
    26 citations · 2012

Key Collaborators

TTTetsu Tanaka1 shared papersHHH. Hashiguchi1 shared papersTFTakafumi Fukushima1 shared papersMKMitsumasa Koyanagi1 shared papersMMM. Murugesan1 shared papersYOYuki Ohara1 shared papersJCJ. C. Bea1 shared papers
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